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The calibrated pull-off apparatus (see 2) shall include a pull-off rod (for instance, a current loop of nichrome or Kovar wire) having a cross-sectional area of 75 percent, +3 percent, -5 percent of the chip surface area.

The test chip substrates shall be processed, metallized, and handled identically with the completed device substrates, during the same time period within which the completed device substrates are processed.

The chips for this test shall be bonded on the same bonding apparatus as the completed devices, during the time period within which the completed devices are bonded.

The sample of chips for this test shall be taken at random from the same chip population as that used in the completed devices that they are intended to represent.

When flip chips are bonded to substrates other than those in completed devices, the following conditions shall apply: All pull tests shall be performed prior to the application of encapsulants, adhesive, or any material which may increase the apparent bond strength. For hybrid or multichip devices, a minimum of 4 die or all die if four are not available on a minimum of 2 completed devices shall be used.

The sample size number and accept number specified shall determine the number of die to be tested (not bonds). All die pulls shall be counted and the specified sampling, acceptance, and added sample provisions shall be observed, as applicable. The test shall be conducted using the following procedure. A calibrated measurement and indication of the applied stress in grams force (gf) shall be provided by equipment capable of measuring stresses up to twice the specified minimum limit value, with an accuracy of ±5 percent or ☐.25 gf, whichever is the greater tolerance.

The apparatus for this test shall consist of suitable equipment for applying the specified stress to the bonds. The purpose of this test is to measure the strength of internal bonds between a semiconductor die and a substrate to which it is attached in a face-bond configuration. MIL-STD-883 method 2031.1 – Flip-chip pull-off test # Purpose #